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GLPOLY
Committed to developing thermal interface
materials based in China serving the world
 
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China's hot material industry
 
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GLPOLY is committed to becoming a leading enterprise in the field of thermal interface material. At Goldlink, developing high quality Thermal Interface Material and Thermal Solutions for electronics industry is our first priority.
We serve a multitude of industries worldwide including automotive, computer, 5G telecommunications, consumer electronics, LED lighting, solar, military and power conversion. We pride ourselves on rapid sampling, extensive product portfolio and top-class technical support.
As a professional Thermal Interface Material manufacturer, we understand problems, we also know that there will always be a better way to help you achieve your goals and objectives. GLPOLY is focused on a single purpose---discovering the need, then developing and delivering the advanced thermal solutions through devotion and innovation.
  • GLPOLYAutomotive electronics
  • GLPOLYIndustrial and medical devices
  • GLPOLYTelecom
 
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Quality raw material, advanced technology, sustainable innovation
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Testing all raw materials, improving processes, GLPOLY focus on delivering advanced thermal solutions to clients.
  • Non silicone thermal putty K=4.0
  • Non silicone thermal putty K=3.0
  • Non silicone thermal putty K=2.5
  • Non silicone thermal putty K=2.0
  • Non silicone thermal gap pad K=6.0
  • Non silicone thermal gap pad K=5.0
  • Non silicone thermal gap pad K=4.0
  • Non silicone thermal gap pad K=3.0
  • Non silicone thermal insulator K=6.0
  • Non silicone thermal insulator K=4.8
  • Non silicone thermal insulator k=3.8
  • Non silicone thermal insulator K=3.0
  • Two-part dispensable thermal pad K=3.0
  • Two-part dispensable thermal pad K=2.0
  • Two-part dispensable thermal pad K=1.5
  • Two-part dispensable thermal pad K=1.0
  • Thermal putty K=4.0
  • Thermal putty K=3.0
  • Thermal putty K=2.5
  • Thermal putty K=2.0
  • Thermal gap pad K=6.0
  • Thermal gap pad K=5.0
  • Thermal gap pad K=4.0
  • Thermal gap pad K=3.0
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