Soft Thermal Pad K=5.0

Model:XK-P50
Thermal Conductivity:5.0 W/(m·K)
Features:

High thermal conductivity, high reliability,High insulation and compressibility,ultra conformable under low pressure, suitable for large institutional design tolerance

Applications:

High-end industrial and medical electronics, and mobile communications equipment, high-speed mass storage drives

PDF Specification:Download
Hotline:+86-755-27579310


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