Non-Silicone Putty Gel K=2.0

Model:XK-GN20
Thermal Conductivity:2.0 W/(m·K)
Features:

Most advanced thermal interface material with excellent compressibility, high thermal conductivity, high insulation, silicone-free, no curing, no siloxane volatiles

Applications:

Automotive systems, telecommunication, consumer electronics

PDF Specification:Download
Hotline:+86-755-27579310


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