Silicone Thermal Pad K=6.0

Model:XK-P60
Thermal Conductivity:6.0 W/(m·K)
Features:

high thermal conductivity and compressibility, low hardness, high reliability, designed for low-stress application

Applications:

Telecommunications, Computer, Between heat-generating semiconductor and a heat sink

PDF Specification:Download
Hotline:+86-755-27579310


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