Thermal Putty Pad K=8.0

Model:XK-P80-Putty
Thermal Conductivity:8.0 W/(m·K)
Features:

High thermal conductivity, high reliability, good creep performace under low bearing capacity and high compressibility circumstance, low molecular weight siloxane content, UL94 V-0 certification

Applications:

Central Processing Unit, Graphics processing Unit and suitable for filling a gap of 0.2mm or less

PDF Specification:Download
Hotline:+86-755-27579310


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