Thermal Putty Gel K=3.2

Model:XK-G30
Thermal Conductivity:3.2 W/(m·K)
Features:

High deformation, designed for UAV, excellent compressibility, low thermal resistance, good creep performance, best for north bridge IC, syringe package for automated assembly

Applications:

Automotive systems, telecommunication, UAV, consumer electronics

PDF Specification:Download
Hotline:+86-755-27579310


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