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Two-part dispensable thermal pad
Dispensable thermal gap filler K=1.5

Thermal conductivity 1.5W/mK

Conforming, ideal for delicate conponent

and low stress applications

Cure at room or elevated temperature

100% solid, no cure by-product

Low and high temperature resistance


Automotive electronics

Electric vehicle battery pack

Computer and peripherals

Between any heat-generating

semiconductor and a heat sink


XK-S serial product is a two-part, high performance thermal gap filler, offerring excellent reliability and stability. It fills the gaps under low pressure before cure and cures at room or elevated temperature as a thermal pad. It is suitable for automated dispensing system, dispensing rate and dose are programmable and controlled.

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